Bluetooth chip | Renesas and Ti launch new Bluetooth chip, try Lenz st17h65 Bluetooth ble5.2 chip

Renesas electronics and Texas Instruments （TI） Have launched for the Internet of things (IoT)、 Bluetooth wireless microcontroller for wearable and medical design , The two companies are on Bluetooth LE Official match .

According to the eeNews reports ,TI Launched the fourth generation Bluetooth with low energy consumption （BLE） Wireless microcontroller CC2340 series , And Reza has launched a product with 2D Dual core device of graphics processor SmartBond DA1470x series .

CC2340 Series use ARM Cortex M0 + The core , In the smallest QFN The dimensions in the package are 4x4 square millimetre ,TI Chip level package versions are also planned . The lowest price is 0.79 dollar （1000 individual ）, Customers can also purchase samples at a price of 39 Dollar development kit . It is expected that 2023 Mass production in the first half of .

Reza's SmartBond DA1470x series , Also trying to take advantage of this surge in demand . And TI The purpose of reducing size and cost is different , This series of Bluetooth has low energy consumption (LE) Chips are built on acquisitions Dialog Based on the design of , Designed to improve integration rather than reduce costs .

DA1470x Integrated power management unit 、 Hardware voice activity detector （VAD） and GPU, For intelligent IOT devices with sensor and graphics functions , And always online audio processing in the same applications of wearable devices such as smart watches and fitness trackers 、 Glucose monitoring readers and other consumer grade healthcare devices 、 Household appliances with monitors 、 Industrial automation and safety systems .

To cope with the rapid development of the Internet of things , Lenz technology launches the latest Bluetooth BLE5.2 chip ST17H65

ST17H65 bluetooth BLE5.2 Chip parameters

ST17H65 bluetooth BLE5.2 The chip is the latest Bluetooth Technology launched by Lenz technology BLE chip , have 512KB Flash +（96KB ROM）+64KB SRAM, Bluetooth protocol stack , No longer occupy Flash Space .64KB Of SRAM, Partition use , More user data can be saved in standby , You can set a large buffer , Support more complex functions . accord with SIG canonical Mesh Ad hoc network application . Including multi node control , And the simultaneous work of one master and multiple slaves .

ST17H65 Yes 23 x GPIO,6 x PWM,-103dBm @BLE 125Kbps,[email protected] 1Mbps. Single ended antenna output , There can be no matching circuit . Support antenna matrix switching , Plug in support LNA Signal amplification .

The biggest advantage is lower power consumption . The previous generation product Bluetooth received peak current >13mA; MCU Power consumption of _{0.5mA/MHz; Average current in low power mode >40uA. The Bluetooth of the new product receives peak current 4.7mA,MCU Power consumption of <60uA/MHz. In low power mode, the average current can be reduced to 20uA}30uA.BLE5 More flexible broadcast packets , Up to 200Byte data ,BLE4 Only 32Byte. Faster transmission rate ,BLE5 You can achieve 20_{30KB/s;BLE4 Generally in 4}5KB/s.

Lenz technology has independently developed wireless RF and low-power Bluetooth BLE5.2 Chip and has global intellectual property rights , in the light of AIoT Internet of things and individual consumers , Provide Bluetooth master fully integrated chip 「 Commonality of software and hardware 」 Solutions and core devices , Supporting all-round APP Software platform customization development . The Bluetooth chip scheme is applied to intelligent wearable devices 、 Bluetooth indoor navigation 、 Smart home 、 Health care 、 Sports build body 、 The data transfer 、 Remote control 、 Personal peripherals and AIoT Internet of things and so on .