IPD chip shipments exceeded 1billion, and chips and semiconductors appeared in ims2022

2022 year 6 month 21 Japan , Shanghai, China —— At home EDA、IPD The industry's leading enterprise cores and semiconductors were held in Denver, USA 2022 year IMS It was announced at the exhibition that , Its IPD The cumulative shipment of chips has exceeded... For the first time 10 Million star .

Cores and semiconductors are integrating passive components IPD And system level packaging SiP The design field has accumulated more than ten years of development experience and successful cases , Combined virtual IDM Pattern , The core and passive components are constructed IPD platform . be based on IPD High technical consistency 、 Strong integration 、 Small size 、 Height Low 、 High reliability 、 The cost is low 、 Customizable 、 Superior performance 、 Advantages such as flexibility of pin layout , Cores and passive components IPD The platform provides coverage filters 、 Multiplexer 、 coupler 、 Balun 、 Resistance capacitance network 、 Match the network 、 A full link solution for passive components such as high-density capacitors from the simulation model to the physical product , Meet the mobile communication market 3G、4G、5G and IoT The demands of various frequency bands and scenarios in the market .

In the past two years, , With 5G and IoT Mass commercial use of products , Core and semiconductor IPD The chip has been highly recognized by the market , Successfully entered the country Tier1 Mainstream mobile phone platforms and supply chains of RF chip companies , The average monthly shipment exceeds 6000 Thousands of stars , Quickly occupied 5G RF and IoT market , And be Yole Selected as global IPD Leading chip supplier . According to the latest statistics , Core and semiconductor IPD The total chip shipments have successfully exceeded 10 Million star .

Core and semiconductor IPD Chip has three core competitiveness , Include ： Unique technical capabilities 、 Strong partnership between wafer factories and packaging factories and strong EDA Tool support, etc .

Core and passive chip IPD Features of the platform include ：

• Including those that have been rigorously verified by the wafer factory IP library ;
• The filter is included 、 Resistance capacitance network 、 Power divider 、 coupler 、 Balun 、 Multiplexer 、 Match the network 、EMI Nearly 100 kinds of passive components such as filters ;
• Be able to customize and develop according to different needs , Help customers improve system performance to the maximum extent , Reduce the number of peripheral devices ;
• Provides a variety of passive component model libraries , Help customers realize the joint simulation of module systems , Provide guidance for analysis and debugging , Greatly enhanced the customer's product design 、 Iteration and optimization capability , Shorten the time to market of customers' products .

Core and passive chip IPD The main application scenarios of the platform include ：

• filter 、 Multiplexers and other devices are mainly used in 5G RF front end module and NB/WiFi/BT/UWB/CAT1/ Power line carrier /TWS Silicon wheat and other scenes
• High density capacitors have lower insertion loss 、 Thinner dimensions 、 Better voltage and temperature stability 、 Smaller ESL/ESR, Mainly used in GPU/CPU/AI/ASIC/DSP And other high-end chip power decoupling and optical modules / Millimeter wave and other ultra wideband modules .

About cores and semiconductors

The core and semiconductor are made in China EDA Industry leader , Provide coverage IC、 The whole industry chain simulation encapsulated into the system EDA Solution , Committed to enabling and accelerating the design of a new generation of high-speed and high-frequency intelligent electronic products .

Core and semiconductor independent intellectual property rights EDA Products and solutions have been continuously verified in semiconductor advanced process nodes and advanced packaging , And in 5G、 A smart phone 、 The Internet of things 、 Artificial intelligence and data center are widely used , It effectively connects the major IC Design companies and manufacturing companies .

Cores and semiconductors are all over the world at the same time 5G RF front end plays an important role in the supply chain , Through independent innovation IPD The chip and system level packaging design platform provides RF front-end devices and modules for mobile phone and Internet of things customers , And be Yole Selected as global IPD Leading filter suppliers .

Cores and semiconductors were created in 2010 year , Formerly known as Xinhe technology , The operation and R & D headquarters are located in Zhangjiang, Shanghai , In Suzhou 、 wuhan 、 Xi'an has a research and development Sub Center , In Silicon Valley 、 Beijing 、 Shenzhen 、 Chengdu 、 Xi'an has sales and technical support department .