Advanced packaging, the beginning of a big cycle -- a symposium on semiconductor equipment

Equipment is the cornerstone of chip manufacturing . Under the dual effects of the shortage of chips and the continuing epidemic , Developing the chip equipment industry has become a strategic move . In order to discuss the above problems , See industry trends 、 Pattern change, etc , Yuanchuan Research Institute in 5 month 26 Japan （ Thursday ）15:30-17:30 organization “ Chip device webinar ”, Three main guests were invited , And a number of industry professionals , Have an in-depth exchange .

At the seminar, Huafeng Technology Co., Ltd （Capcon Limited） Wanghongbo, co-founder and chairman of the board, gave a keynote speech on advanced packaging equipment . Wanghongbo said , Advanced packaging is a field that we are focusing on , Whether it is the manufacturer behind the road , It is also the manufacture of the previous road , All pay special attention to advanced packaging , Think this is the beginning of a big cycle . Huafeng Technology focuses on high-precision chip taking and placing in the back channel （Pick & Place） link , The future goal is to provide customers with advanced packaged overall solutions .

Wang Hongbo thinks , Semiconductor equipment localization , The localization of the rear packaging equipment is actually more serious than that of the front . The degree of localization of front track equipment has exceeded 10%, However, the degree of localization of downstream equipment is still in single digits ,. For advanced packaging ,Die Bonder The value is similar to that of a lithography machine , It accounts for about of the rear equipment 1/4～1/3, Huafeng Technology focuses on Die Bonder Such key links , In the field of wafer level packaging , Huafeng Technology has achieved the second place in the global market , With the sustained and rapid development of Huafeng business , We are more confident that wafer level packaging can achieve the first position .

The difficulty and importance of back channel equipment in our country have been paid attention to in recent two years , In the early days, government departments and industry analysts mainly focused on front-end equipment , But with the in-depth understanding of the industry , We found that the threshold of the rear equipment is actually very high . The precision of our existing mass-produced products of Huafeng technology can reach 3-5μm, Abreast of the times Hybrid bonding The device has reached sub micron level （200nm） Accuracy requirements , It has almost reached a limit in the mechanical field , It's a very big challenge . From Huafeng himself , The company's own technical capacity only gives us half of the equipment capacity ; Then the other half of the capacity of the equipment , It's called know how, In fact, our customers brought us , This shows that the development of advanced packaging equipment and the close cooperation between customers are very deep , Almost all of the customers of Huafeng technology are leaders in the industry , Provide suggestions for improvement , Let Huafeng technology develop very rapidly in the field of advanced packaging .

Wanghongbo specially mentioned , The difference between advanced packaging and traditional packaging is that the process and function are relatively unstable , The performance and cost of each product are different , This requires the equipment provider to break away from the fixed mode , Be able to flexibly adapt to this change . Huafeng adopts “ Platform plus module ” The pattern of , Use a unified platform to fix the core of mass production demand , Ensure the accuracy of the whole equipment 、 Speed and stability ; Then different modules are used to adapt to different advanced packaging processes and different customers' customized requirements for processes , In this way, Huafeng can launch a new product every six months .

On the expansion of chip demand and tight supply chain , Wanghongbo summed up three reasons ：

On the one hand, the demand for electric vehicles is expanding rapidly , The number of single chip has changed from dozens of chips to thousands of chips , This rapid growth in demand has squeezed other capacity ;

On the other hand , The actual production is relatively conservative , Resulting in continuous supply tension ; The third is , Geopolitics leads to this artificial disturbance of the supply chain .

About the possible supply and demand of semiconductors in the last twoorthree years . Wanghongbo said , The demand for expansion of global Fabs is relatively certain , Packaging is in line with the capacity expansion of the wafer factory , We believe that the overall demand for advanced packaging is just beginning , future 3-5 The demand in is very strong .ASE Now we have 50 Many machines are in mass production , But still can not meet the needs of customers , There is no sign of slowing down the pace of production expansion .

Huafeng Technology Co., Ltd 2014 Founded in Hong Kong, China , Is a global company headquartered in Hong Kong, China and in Singapore 、 R & D of the world's leading semiconductor advanced packaging equipment with R & D center and production base in Chinese Mainland 、 production 、 Manufacturing companies . The company focuses on chip loading in the advanced chip packaging process , Through continuous R & D investment , It has accumulated excellent core technology in the field of high-end semiconductor packaging equipment , Especially in Flip Chip、Fan-Out encapsulation 、2.5D/3D encapsulation 、SIP、Stack-Die Memory Advanced packaging such as laminated packaging 、Panel Level Package There is a mature product line on the panel level packaging equipment . The company practices the strategy of leading the high-end market , Has successfully entered the sun and moonlight 、 TSMC 、 Tongfu micro electricity 、 Silicon products 、NEPES、 Changdian Technology 、 Alex science and technology 、 The supplier system of many large semiconductor packaging and testing manufacturers such as Yuemo advanced , It has become the main wafer level production process of the largest packaging and testing enterprise in the world （M-Series） Exclusive supplier of key equipment .