Solution to component stele in SMT chip processing

Smt The solution to the problem of component monument in SMT processing

In the chip processing, there will be steles 、 Grape ball 、 Bridge and other welding problems , How did the monument come into being , How to solve , The following is the analysis of intelli technology ：

The reasons for the formation of the monument

It's because of the different amount of solder on both ends of the component , After reflow soldering high temperature furnace , One end of the tin melts faster , The other end melts slowly , It leads to unbalanced force at both ends , As the reflow temperature increases , The two ends of the melt are not balanced , Cause one end to tilt up , There is a phenomenon of erecting steles .

SMT The reason of the problem in SMT processing

The solution to the phenomenon of erecting a monument

1. Solve by design

Reduce the inside distance of the pad , Minimize the distance between the two end pads without short circuit , Let the solder paste at the slow melting end have more space to stick and avoid standing up , Increase the difficulty of erecting a monument .

2. Through the process

Slow down the heating rate of reflow zone , Give Way PCB The temperature of all the lines on the bus can reach the same level , And then melt the tin at the same time

Other reasons for erecting steles

One sided oxidation of electronic components , resolvent ： Change the electronics

The mounting electronic components of the mounter deviate greatly , resolvent ： Check whether it's a suction nozzle or a Feida problem or a camera MARK I'm not sure .

Offset of solder paste printing , resolvent ： Check whether the steel mesh is out of position , Check the pressure and speed of the scraper

Jiangxi yingteli
The company address ： High tech Industrial Park, Linchuan District, Fuzhou City, Jiangxi Province 8、9 building

Company website ：http://www.intelli40.cn

The main business of the company is ：OEM/ODM OEM ,smt Patch processing ,DIP Plug in post welding processing , Product assembly / Packaging processing